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Introduction
Chapter
1: Introduction to Machining with Lasers
Chapter
2: Time Scales
Chapter
3: Machining with Long Pulses
Chapter
4: Nanosecond Machined Samples
Chapter
5: Machining with Ultrafast Laser Pulses
Chapter
6: Femtosecond Machined Samples
Chapter
7: Contamination, Debris, Etc.
Chapter
8: Heat Affected Zone (HAZ)
Chapter
9: Machining Accuracy
Chapter
10: Sub-micron Features
Chapter
11: Machining Inside Bulk Materials
Chapter
12: Introduction to Waveguides
Chapter
13: Active Waveguides
Chapter
14: Shortcomings of Femtosecond Lasers
Chapter
15: Materials We've Machined
Chapter
16: Conclusion
Appendices:
References
and Glossary |
While most of the
unique characteristics associated with micromachining with
ultrafast lasers can be explained by the lack of thermal diffusion,
some important features, notably the extreme high shot-to-shot
repeatability, the ability to create sub-micron features,
and the capability to machine inside transparent materials,
requires a more detailed look at the physics behind the interaction
of light with matter. How does light interact with matter?
Figures 9.1, and 9.2 will help us get a deeper understanding.
| Figure 9.1 Avalanche Ionization -
Example 1 |
Figure 9.1 shows a long
laser pulse interacting with a typical sample. The sample
is formed of atoms and electrons. For clarity Figure 9.1
shows only the electrons. The electrons are either bound
or free. Bound electrons are tightly attached
to the local atoms. In contrast free electrons are not
tightly attached to the local atoms. The ratio of bound
electrons to free electrons is a function of the material.
Metals have mostly free electrons, while semiconductors
and insulators have very few free electrons. Figure 9.1
shows very few free electrons. It is representative of
a semiconductor. |

|
Click
on the above image to view a series of three animations
of long-pulse avalanche ionization and a side-by-side
comparison of the results.
NOTE:
You must have the Macromedia Flash
Player to view the animations.
You may
"right-click" on the animation to display
a pop-up menu for controlling the animation or use the
Pause and Play buttons in the animation itself.
|
Now lets look at the other key
component present in the animations viewed through Figure 9.1:
the laser pulse. So far we have represented laser pulses as
a solid chunk of energy." Now we need to think of
the optical pulse as an electromagnetic wave packet. The wave
frequency corresponds to the color of the laser
pulse, the length of the wave packet corresponds to the duration
of the laser pulse, and the amplitude of the wave corresponds
to the peak power of the laser.
As the optical wave packet (i.e. laser pulse) enters the sample
the electrons start to oscillate. The bound electrons are tightly
localized and can only wiggle slightly. In contrast,
the free electrons, which are unbound, can oscillate strongly
once they are in the laser field. While oscillating they occasionally
collide with the surrounding atoms. If the laser field is intense
enough, a free electron colliding with a surrounding atom will
knock off an additional electron. Now there are two free electrons
that are being driven by the light field. They in turn can knock
two more electrons off atoms in the surrounding material. These
four electrons create four more free electrons through collisions,
and so on.
This type of multiplication effect is called an avalanche effect,
and because it creates electrons by ionizing atoms, it is called
'avalanche ionization.'
The full process is shown in the animations as seen through
Figure 9.1. For this avalanche process to start, a free electron
must be present initially in the electromagnetic field. The
absence of free electrons prevents the avalanche process from
significantly starting and ultimately hinders the material ablation.
In metal there are plenty of free
electrons; the avalanche process starts immediately. This leads
to reproducible machining (there may be other problems associated
with heat diffusion).
In semiconductors or isolators
there are naturally very few free electrons. The avalanche process
may start right away or may not, depending on the presence or
absence of a free electron in the beam path. If we have initially
several free electrons in the electromagnetic field, then the
process will be very efficient. If we have no free
electron, then the process will not start. We are basically
relying on luck to get the machining process going! This variability,
which is inherent to the physical process, leads to unstable
machining rates. Note that the laser may be perfectly stable,
the beam spot size and amount of energy in the pulse may be
precisely the same from shot-to-shot, yet the material ablation
will vary significantly from shot to shot. This is a serious
limitation when trying to do very fine machining.
Can we do anything about it? Can we outsmart
the physics of the interaction?
Yes, that is possible. If we can
somehow create, a priori, large quantities of free electrons
then the presence or absence of naturally occurring free electrons
will no longer be an important factor. What matters is the total
number of free electrons, not their origin.
So, how do we produce a large
quantity of free electrons?
There are at least two ways to
do it. Both approaches rely on the same underlying principle:
We always have a lot of electrons in our work piece. It is just
that the vast majority of them may be bound and not useful to
get the avalanche process going. If we could turn these bound
electrons immediately into free electrons then we would have
solved our problem.
We can achieve this goal using
lasers working in the ultraviolet, or using ultrafast lasers.
Figure 9.2 shows what happens with an ultrafast laser.
| Figure 9.2 Avalanche Ionization -
Example 2 |
Figure 9.1 shows a long
laser pulse interacting with a typical sample. The sample
is formed of atoms and electrons. For clarity Figure 9.1
shows only the electrons. The electrons are either bound
or free. Bound electrons are tightly attached
to the local atoms. In contrast free electrons are not
tightly attached to the local atoms. The ratio of bound
electrons to free electrons is a function of the material.
Metals have mostly free electrons, while semiconductors
and insulators have very few free electrons. Figure 9.1
shows very few free electrons. It is representative of
a semiconductor. |

|
Click
on the above image to view an animated version of avalanche
ionization initiated with an ultrafast laser.
NOTE:
You must have the Macromedia Flash
Player to view the animations.
You may
"right-click" on the animation to display
a pop-up menu for controlling the animation or use the
Pause and Play buttons in the animation itself.
|
The amplitude of the electromagnetic
field corresponds to the peak power of the laser. Ultrafast
lasers generate tremendous peak power as shown in Figure 9.2.
Remember what we said earlier:
"
as the optical wave packet (i.e. laser pulse) enters
the sample, the electrons start to oscillate. The bound electrons
are tightly localized and can only wiggle slightly."
This is correct under normal conditions. But we are not operating
under normal conditions when the sample is illuminated
with ultrafast pulses and their extremely intense electromagnetic
fields.
The electromagnetic field is so
high that the bound electrons are knocked free.
Immediately we find ourselves with a large quantity of free
electrons and the avalanche ionization process can start immediately,
reliably, and reproducibly. This leads to high-quality machining,
as shown clearly in Figure 9.3.
| Figure 9.3 Avalanche Ionization -
Example 3 |
Figure 9.3 show a comparison
between long and short pulsed lasers. |

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